Touch panel and method of manufacturing the same

ABSTRACT

A touch panel and a method of manufacturing the touch panel are provided. The touch panel includes a substrate comprising a wiring area and a sensor area, a sensing pattern located on a surface of the substrate in the sensor area, and a wiring line located on the surface of the substrate in the wiring area and electrically connected to the sensing pattern. The sensing pattern includes a plurality of first fine metal lines arranged irregularly in a mesh, and a first photosensitive layer pattern residue located between at least two of the first fine metal lines.

This application is a continuation application of U.S. patentapplication Ser. No. 15/957,839 filed on Apr. 19, 2018, which is adivisional application of U.S. patent application Ser. No. 14/668,765filed on Mar. 25, 2015, which claims priority from Korean PatentApplication No. 10-2014-0170610 filed Dec. 2, 2014 in the KoreanIntellectual Property Office, the disclosures of which are incorporatedherein by reference in their entirety.

BACKGROUND 1. Technical Field

The present disclosure generally relates to a touch panel and a methodof manufacturing the same.

2. Description of the Related Art

Touch panels are often used as input devices to liquid crystal displays(LCDs) and organic light-emitting displays (OLEDs). When a touch panelis used as an input device, a user can input commands to the touch panelusing a hand or an object such as a pen. The touch panel can detect atouch position by sensing a change in capacitance or voltage between twoelectrodes, and provide a user command (corresponding to the touchposition) to a display device.

Generally, a touch panel includes sensing electrodes and wiring linesconnected to the sensing electrodes. The sensing electrodes areconfigured to sense the touch position of a hand or an object. In aconventional touch panel, the sensing electrodes are typically made of atransparent conductive material such as indium tin oxide (ITO). However,ITO has high surface resistance and may reduce the signal sensitivityand detection sensitivity of the touch panel.

SUMMARY

The present disclosure provides a touch panel having improved detectionsensitivity and transmittance, and a method of manufacturing the touchpanel.

According to an embodiment of the inventive concept, a touch panel isprovided. The touch panel includes: a substrate comprising a wiring areaand a sensor area; a sensing pattern located on a surface of thesubstrate in the sensor area; and a wiring line located on the surfaceof the substrate in the wiring area and electrically connected to thesensing pattern, wherein the sensing pattern comprises a plurality offirst fine metal lines arranged irregularly in a mesh, and a firstphotosensitive layer pattern residue located between at least two of thefirst fine metal lines.

In some embodiments, the sensing pattern and the wiring line may be madeof a same material.

In some embodiments, each of the sensing pattern and the wiring line mayinclude any one of molybdenum (Mo), silver (Ag), titanium (Ti), aluminum(Al), copper (Cu), gold (Au), platinum (Pt), and nickel (Ni), or analloy thereof.

In some embodiments, the first photosensitive layer pattern residue maybe made of a positive photosensitive resin.

In some embodiments, the wiring line may include a plurality of secondfine metal lines arranged irregularly in a mesh, and a secondphotosensitive layer pattern residue located between at least two of thesecond fine metal lines.

According to another embodiment of the inventive concept, a method ofmanufacturing a touch panel is provided. The method includes: providinga substrate comprising a wiring area, a sensor area, and a non-sensorarea; forming a photosensitive layer pattern on a surface of thesubstrate, wherein the photosensitive layer pattern comprises a firstpattern located in the sensor area and a second pattern located in thenon-sensor area; forming gaps in the first pattern; forming a metallayer on the photosensitive layer pattern and the surface of thesubstrate; and forming a sensing pattern in the sensor area and a wiringline in the wiring area by removing the second pattern and a portion ofthe metal layer located on the second pattern.

In some embodiments, a first height measured from the surface of thesubstrate to a top surface of the first pattern may be less than asecond height measured from the surface of the substrate to a topsurface of the second pattern.

In some embodiments, forming the gaps in the first pattern may includedrying the photosensitive layer pattern.

In some embodiments, drying the photosensitive layer pattern may includeapplying heat to the photosensitive layer pattern.

In some embodiments, forming the photosensitive layer pattern on thesurface of the substrate may include: forming a photosensitive layer bycoating a photosensitive resin on the surface of the substrate; andexposing and developing the photosensitive layer using a mask, whereinthe mask may include a semi-transmitting mask pattern corresponding tothe sensor area, a first mask pattern corresponding to the non-sensorarea, and a second mask pattern corresponding to the wiring area.

In some embodiments, the photosensitive resin may be a positivephotosensitive resin, the first mask pattern may be a light-blockingpattern, and the second mask pattern may be a light-transmittingpattern.

In some embodiments, the metal layer may include any one of molybdenum(Mo), silver (Ag), titanium (Ti), aluminum (Al), copper (Cu), gold (Au),platinum (Pt), and nickel (Ni), or an alloy thereof.

According to a further embodiment of the inventive concept, a method ofmanufacturing a touch panel is provided. The method includes: providinga substrate comprising a wiring area, a sensor area, and a non-sensorarea; forming a photosensitive layer pattern on a surface of thesubstrate, wherein the photosensitive layer pattern comprises a firstpattern located in the sensor area, a second pattern located in thenon-sensor area, and a third pattern located in the wiring area; forminggaps in the first pattern and the third pattern; forming a metal layeron the photosensitive layer pattern; and forming a sensing pattern inthe sensor area and a wiring line in the wiring area by removing thesecond pattern and a portion of the metal layer located on the secondpattern.

In some embodiments, a second height measured from the surface of thesubstrate to a top surface of the second pattern may be greater thaneach of a first height measured from the surface of the substrate to atop surface of the first pattern and a third height measured from thesurface of the substrate to a top surface of the third pattern.

In some embodiments, forming the photosensitive layer pattern on thesurface of the substrate may include: forming a photosensitive layer bycoating a photosensitive resin on the surface of the substrate; andexposing and developing the photosensitive layer using a mask, whereinthe mask may include a first semi-transmitting mask patterncorresponding to the sensor area, a second semi-transmitting maskpattern corresponding to the wiring area, and a mask patterncorresponding to the non-sensor area.

In some embodiments, the photosensitive resin may be a positivephotosensitive resin and the mask pattern may be a light-blockingpattern.

In some embodiments, the metal layer may include any one of molybdenum(Mo), silver (Ag), titanium (Ti), aluminum (Al), copper (Cu), gold (Au),platinum (Pt), and nickel (Ni), or an alloy thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects and features of the inventive concept willbe more apparent when exemplary embodiments of the inventive concept aredescribed with reference to the attached drawings.

FIG. 1 is a schematic plan view of a touch panel according to anembodiment.

FIG. 2 is an enlarged plan view of portion P1 of FIG. 1 .

FIG. 3 is an enlarged plan view of portion P2 of FIG. 2 .

FIG. 4 is a cross-sectional view of the touch panel of FIG. 2 takenalong line IV-IV′.

FIGS. 5, 6, 7, 8, and 9 are cross-sectional views of the touch panel ofFIG. 4 at different stages of manufacture according to an exemplarymethod of manufacturing the touch panel.

FIG. 10 is a cross-sectional view of a touch panel according to anotherembodiment.

FIGS. 11, 12, 13, 14, and 15 are cross-sectional views of the touchpanel of FIG. 10 at different stages of manufacture according to anexemplary method of manufacturing the touch panel.

DETAILED DESCRIPTION

Advantages and features of the inventive concept and methods ofaccomplishing the same may be understood more readily with reference tothe following detailed description of certain embodiments and theaccompanying drawings. The inventive concept may, however, be embodiedin many different forms and should not be construed as being limited tothe embodiments set forth herein. Rather, these embodiments are providedso that this disclosure is thorough and complete and fully convey theconcept of the inventive concept to those skilled in the art. Likereference numerals refer to like elements throughout the specification.

The terminology used herein is for describing the embodiments and shouldnot be construed in a limiting manner. As used herein, the singularforms “a”, “an”, and “the” are intended to include the plural forms aswell, unless the context clearly indicates otherwise. It will be furtherunderstood that the terms “comprises” and/or “comprising,” when used inthis specification, specify the presence of stated features, integers,steps, operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to”, or “coupled to” another element or layer, itcan be directly on, connected, or coupled to the other element or layer,or with one or more intervening elements or layers being present. Incontrast, when an element is referred to as being “directly on”,“directly connected to”, or “directly coupled to” another element orlayer, there are no intervening elements or layers present. As usedherein, the term “and/or” includes any and all combinations of one ormore of the associated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by those terms. Those terms are merelyused to distinguish one element, component, region, layer, or sectionfrom another region, layer, or section. Thus, a first element,component, region, layer, or section described below could be termed asecond element, component, region, layer, or section without departingfrom the teachings of the inventive concept.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper”, and the like, may be used herein for ease of description todescribe one element or feature's spatial relationship to anotherelement(s) or feature(s) as illustrated in the figures. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or operation in addition tothe orientation depicted in the figures. For example, if the device inthe figures is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. The device may be otherwiseoriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein interpreted accordingly.

Embodiments are described herein with reference to cross-sectionillustrations that are schematic illustrations of idealized embodiments(and intermediate structures). As such, variations from the shapes ofthe illustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, these embodiments shouldnot be construed as being limited to the particular shapes of regionsillustrated herein but are to include deviations in shapes that mayresult, for example, from manufacturing. The regions illustrated in thefigures are schematic in nature and their shapes are not intended toillustrate the actual shape of a region of a device and are not intendedto limit the scope of the inventive concept.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which the inventive concept belongs. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andthis specification, and should not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

FIG. 1 is a schematic plan view of a touch panel according to anembodiment. FIG. 2 is an enlarged plan view of portion P1 of FIG. 1 .FIG. 3 is an enlarged plan view of portion P2 of FIG. 2 . FIG. 4 is across-sectional view of the touch panel of FIG. 2 taken along lineIV-IV′.

Referring to FIGS. 1 through 4 , a touch panel 1 according to anembodiment may include a substrate 100, a plurality of sensing patterns200, and a plurality of wiring lines 270. In some embodiments, the touchpanel 1 may further include one or more first connectors 220, insulatinglayer patterns 240, one or more second connectors 250, and a pad unit290.

The substrate 100 is a transparent substrate having a surface on whichthe sensing patterns 200 and the wiring lines 270 are placed. Thesubstrate 100 may be made of an insulating material such as glass,plastic, silicon or synthetic resin. In some embodiments, the substrate100 may be a flexible film.

The substrate 100 may include a sensor area SA, a wiring area WA, and anon-sensor area NSA, as illustrated in FIG. 4 . The sensing patterns 200are configured to sense a touch position of a hand or an object, and arelocated in the sensor area SA. Specifically, the sensing patterns 200may be located on the surface of the substrate 100 in the sensor areaSA. The first connectors 220, the insulating layer patterns 240, and thesecond connectors 250 may also be located in the sensor area SA.

The wiring lines 270 are electrically connected to the sensing patterns200, and are located in the wiring area WA. The wiring area WA may belocated on a periphery of the surface of the substrate 100. The pad unit290 is connected to the wiring lines 270. The wiring lines 270 and thepad unit 290 may be located on the surface of the substrate 100 in thewiring area WA.

In some embodiments, a driver circuit board (not illustrated) configuredto drive the touch panel 1 may be electrically connected to the pad unit290.

The non-sensor area NSA may be defined as an area excluding the sensorarea SA and the wiring area WA. The sensing patterns 200, the firstconnectors 220, the second connectors 250, and the wiring lines 270 arenot located in the non-sensor area NSA.

The sensing patterns 200 may be located on the surface of the substrate100 in the sensor area SA. In an exemplary embodiment, the sensingpatterns 200 may include a plurality of first sensing patterns 210arranged in a first direction and a plurality of second sensing patterns230 arranged in a second direction intersecting the first direction. Thefirst direction and the second direction may be oblique to each other,as illustrated in FIG. 1 .

The first sensing patterns 210 and the second sensing patterns 230 maybe located at a same level. When the first and second sensing patterns210 and 230 are located at the same level, it means that the first andsecond sensing patterns 210 and 230 are co-located in a same layer. Insome embodiments, the first sensing patterns 210 and the second sensingpatterns 230 may be formed directly on the surface of the substrate 100.

The first sensing patterns 210 and the second sensing patterns 230 maybe made of a conductive material. The conductive material may be a metalmaterial with low resistivity. Accordingly, the conductive material mayreduce the resistance between the sensing patterns 200 or the resistancebetween the sensing patterns 200 and the wiring lines 270, therebyimproving detection sensitivity. In some embodiments, the conductivematerial may include, but is not limited to, any one of molybdenum (Mo),silver (Ag), titanium (Ti), aluminum (Al), copper (Cu), gold (Au),platinum (Pt), and nickel (Ni), or an alloy of any of the above metals.

In some embodiments, the first sensing patterns 210 and the secondsensing patterns 230 may be made of a same material in a same process.

Each of the first and second sensing patterns 210 and 230 may include aplurality of first fine metal lines arranged irregularly to form a mesh.

For example, referring to FIG. 3 , a first sensing pattern 210 mayinclude a plurality of first fine metal lines 210 a arranged irregularlyin a mesh and spaces 210 b located between the first fine metal lines210 a.

Since each of the first and second sensing patterns 210 and 230comprises a mesh of the first fine metal lines 210 a, the shapes of thesensing patterns 200 will not be visible due to a difference intransmittance between an area with the sensing patterns 200 and an areawithout the sensing patterns 200. In addition, the light transmittanceof the touch panel 1 can be improved by using the mesh of first finemetal lines 210 a for the first and second sensing patterns 210 and 230.

In some embodiments, a photosensitive layer pattern residue Q1 may belocated in some of the spaces 210 b between the first fine metal lines210 a. The photosensitive layer pattern residue Q1 may be made of aphotosensitive resin. In an exemplary embodiment, the photosensitiveresin may be a positive photosensitive resin. However, the inventiveconcept is not limited thereto. In another embodiment, thephotosensitive resin may be a negative photosensitive resin.

Adjacent first sensing patterns 210 arranged along the first directionmay be connected to each other by the first connectors 220 located onthe surface of the substrate 100.

The first connectors 220 may be located on the surface of the substrate100 in the sensor area SA. In some embodiments, the first connectors 220may be located at the same level as the first sensing patterns 210 andthe second sensing patterns 230, and formed directly on the surface ofthe substrate 100.

Similar to the first sensing patterns 210 and the second sensingpatterns 230, the first connectors 220 may also be made of a conductivematerial. In some embodiments, the first connectors 220 may be made ofthe same material as the first sensing patterns 210 and the secondsensing patterns 230, and may be formed in the same process as the firstsensing patterns 210 and the second sensing patterns 230. In someembodiments, the first connectors 220 may be formed integrally with thefirst sensing patterns 210.

In some embodiments, each of the first connectors 220 may include a meshof fine metal lines similar to those in the first sensing patterns 210and the second sensing patterns 230. For example, each of the firstconnectors 220 may include a plurality of fine metal lines arrangedirregularly in a mesh.

The insulating layer patterns 240 may be located on the first connectors220 covering the first connectors 220. In some embodiments, theinsulating layer patterns 240 may completely cover the first connectors220. In some embodiments, the insulating layer patterns 240 may be madeof, but is not limited to, an organic insulating material.

The second connectors 250 may be located on the insulating layerpatterns 240 intersecting the first connectors 220. The secondconnectors 250 may electrically connect adjacent second sensing lines230 arranged along the second direction.

The second connectors 250 may be made of a conductive material, and theconductive material may be a metal material with low resistivity.Examples of the conductive material are the same as those describedabove in the description of the first sensing patterns 210 and thesecond sensing patterns 230, and thus a detailed description thereof isomitted.

The wiring lines 270 may be located on the surface of the substrate 100in the wiring area WA. The wiring lines 270 may be electricallyconnected to the first sensing patterns 210 and the second sensingpatterns 230. In some embodiments, the wiring lines 270 may be directlyconnected to at least one of the sensing patterns 200 located on anoutermost edge of the sensor area SA.

The wiring lines 270 may be located at the same level as the firstsensing patterns 210 and the second sensing patterns 230. In someembodiments, the wiring lines 270 may be formed directly on the surfaceof the substrate 100. The wiring lines 270 may be made of a conductivematerial, and the conductive material may be a metal material with lowresistivity. Examples of the conductive material are the same as thosedescribed above in the description of the first sensing patterns 210 andthe second sensing patterns 230, and thus a detailed description thereofis omitted.

In some embodiments, the wiring lines 270 may be made of the samematerial as the first sensing patterns 210 and the second sensingpatterns 230 in the same process.

Next, a method of manufacturing the touch panel 1 will be described.

FIGS. 5, 6, 7, 8, and 9 are cross-sectional views of the touch panel 1of FIG. 4 at different stages of manufacture according to an exemplarymethod of manufacturing the touch panel.

Referring to FIGS. 5 through 9 , a substrate 100 having a defined sensorarea SA, a non-sensor area NSA, and a wiring area WA, is provided. Asshown in FIG. 5 , a photosensitive layer 11 is formed on a surface ofthe substrate 100. The photosensitive layer 11 may be formed byspreading or coating a liquid photosensitive resin. The photosensitivelayer 11 may be a positive photosensitive layer whereby its exposedportion can be removed by development. However, the inventive concept isnot limited thereto. In some other embodiments, the photosensitive layer11 may be a negative photosensitive layer whereby its unexposed portioncan be removed by development.

After the photosensitive layer 11 is formed, a mask 800 is placed abovethe surface of the substrate 100. The mask 800 may include asemi-transmitting mask pattern 810 corresponding to the sensor area SA,a first mask pattern 830 corresponding to the non-sensor area NSA, and asecond mask pattern 850 corresponding to the wiring area WA. Thesemi-transmitting mask pattern 810 may be a halftone pattern or a slitpattern. If the photosensitive layer 11 is a positive photosensitivelayer, the first mask pattern 830 may be a light-blocking pattern, andthe second mask pattern 850 may be a light-transmitting pattern. Forease of description, an embodiment in which the photosensitive layer 11is a positive photosensitive layer will be described herein as anexample. However, the inventive concept is not limited thereto. Inanother embodiment, if the photosensitive layer 11 is a negativephotosensitive layer, the first mask pattern 830 may be alight-transmitting pattern, and the second mask pattern 850 may be alight-blocking pattern.

The photosensitive layer 11 is exposed to light by irradiatingultraviolet (UV) light L (from above the substrate 100) to the substrate100. A portion of the photosensitive layer 11 located on the surface ofthe substrate 100 in the wiring area WA is fully exposed, whereas aportion of the photosensitive layer 11 located on the surface of thesubstrate 100 in the sensor area SA is partially exposed. In contrast, aportion of the photosensitive layer 11 located on the surface of thesubstrate 100 in the non-sensor area NSA is not exposed.

The exposed portions of the photosensitive layer 11 are removed by adevelopment process. As a result, a photosensitive layer pattern 110including a first pattern 111 located in the sensor area SA and a secondpattern 113 located in the non-sensor area NSA, is formed as illustratedin FIG. 6 . As shown in FIG. 6 , the photosensitive layer pattern 110 isnot formed in the wiring area WA.

A thickness of the first pattern 111 may be less than a thickness of thesecond pattern 113. For example, a height H1 (measured from the surfaceof the substrate 100 to a top surface of the first pattern 111) may beless than a height H2 (measured from the surface of the substrate 100 toa top surface of the second pattern 113).

Next, the photosensitive layer pattern 110 is dried, thereby forminggaps 111 b in the first pattern 111, as illustrated in FIG. 7 . In otherwords, the dried first pattern 111 includes the gaps 111 b and remainingpatterns 111 a between the gaps 111 b. To form the gaps 111 b, heat maybe applied to the photosensitive layer pattern 110, and physical impact(such as vibrations) may also be applied to the photosensitive layerpattern 110. In addition, a chemical treatment process using an etchantmay be performed to form the gaps 111 b. In some embodiments, thedensity and interval between the gaps 111 b may be adjusted bycontrolling the temperature and duration of the heat treatment that isapplied to the photosensitive layer pattern 110.

Referring to FIG. 8 , a metal layer 20 is formed on the surface of thesubstrate 100 and the photosensitive layer pattern 110. The metal layer20 may be formed by sputtering, evaporation, an electrochemical solutionprocess, electroplating, etc.

A portion of the metal layer 20 is deposited on the first pattern 111and fills the gaps 111 b to form a plurality of first fine metal lines210 a. A portion of the metal layer 20 is deposited on the wiring areaWA of the substrate 100 to form wiring lines 270. Since the metal layer20 is formed over the entire surface of the substrate 100, a portion 230of the metal layer 20 may be formed on the second pattern 113.

When the first and second patterns 111 and 113 of the photosensitivelayer pattern 110 are removed, the portion 230 of the metal layer 20located on the second pattern 113 will be removed via a “lift-off”process. Accordingly, a touch panel including a wiring line 270 locatedon the surface of the substrate 100 in the wiring area WA and a sensingpattern 210 located on the surface of the substrate 100 in the sensorarea SA is formed, as illustrated in FIG. 9 . The sensing pattern 210includes a mesh of the first fine metal lines 210 a previously describedwith reference to FIGS. 1 through 4 .

As shown in FIG. 9 , spaces 210 b are formed between the first finemetal lines 210 a. In some instances, some of the remaining patterns 111a may not be completely removed and may remain in some of the spaces 210b. That is, the touch panel according to the above-described embodimentmay have a photosensitive layer pattern residue Q1 remaining in some ofthe spaces 210 b.

In some embodiments (not shown), the exemplary method described in FIGS.5 through 9 may further include forming an insulating layer pattern 240(see, e.g., FIG. 4 ) and forming a second connector 250 (see, e.g., FIG.2 ).

Using the exemplary method described in FIGS. 5 through 9 , a mesh ofsensing patterns can be formed. In addition, since sensing patterns andwiring lines can be formed simultaneously, the manufacturing process forthe touch panel can be further simplified.

FIG. 10 is a cross-sectional view of a touch panel according to anotherembodiment. The touch panel of FIG. 10 is similar to the touch panel ofFIG. 4 except for the structure of the wiring line. A repeateddescription of those similar elements will be omitted, and the followingdescription shall focus on the differences between the embodiments ofFIGS. 4 and 10 .

Referring to FIG. 10 , a wiring line 270 may include a plurality ofsecond fine metal lines 270 a arranged irregularly to form a mesh andspaces 270 b located between the second fine metal lines 270 a.

In some embodiments, a photosensitive layer pattern residue Q2 may belocated in some of the spaces 270 b between the second fine metal lines270 a. The photosensitive layer pattern residue Q2 may be made of aphotosensitive resin. In an exemplary embodiment, the photosensitiveresin may be a positive photosensitive resin. However, the inventiveconcept is not limited thereto. In another embodiment, thephotosensitive resin may be a negative photosensitive resin. Aphotosensitive layer pattern residue Q1 may be located in a sensor areaSA. The photosensitive layer pattern residue Q2 located in a wiring areaWA may be made of the same material as the photosensitive layer patternresidue Q1 located in the sensor area SA.

FIGS. 11, 12, 13, 14, and 15 are cross-sectional views of the touchpanel of FIG. 10 at different stages of manufacture according to anexemplary method of manufacturing the touch panel.

Referring to FIGS. 11 through 15 , a substrate 100 having a definedsensor area SA, a non-sensor area NSA, and a wiring area WA, isprovided. As shown in FIG. 11 , a photosensitive layer 11 is formed on asurface of the substrate 100. The photosensitive layer 11 may be formedby spreading or coating a liquid photosensitive resin. Thephotosensitive layer 11 may be a positive photosensitive layer, but theinventive concept is not limited thereto. As previously described withreference to FIGS. 4 through 9 , the photosensitive layer 11 may be anegative photosensitive layer in some other embodiments.

After the photosensitive layer 11 is formed, a mask 900 is placed abovethe surface of the substrate 100. The mask 900 may include a firstsemi-transmitting mask pattern 910 corresponding to the sensor area SA,a mask pattern 930 corresponding to the non-sensor area NSA, and asecond semi-transmitting mask pattern 950 corresponding to the wiringarea WA. Each of the first semi-transmitting mask pattern 910 and thesecond semi-transmitting mask pattern 950 may be a halftone pattern or aslit pattern.

If the photosensitive layer 11 is a positive photosensitive layer, themask pattern 930 may be a light-blocking pattern. For ease ofdescription, an embodiment in which the photosensitive layer 11 is apositive photosensitive layer will be herein described as an example.However, the inventive concept is not limited thereto. In anotherembodiment, if the photosensitive layer 11 is a negative photosensitivelayer, the mask pattern 930 may be a light-transmitting pattern.

The photosensitive layer 11 is exposed to light by irradiating UV lightL to the substrate 100 (from above the substrate 100). A portion of thephotosensitive layer 11 located on the surface of the substrate 100 inthe wiring area WA and a portion of the photosensitive layer 11 locatedon the surface of the substrate 100 in the sensor area SA are partiallyexposed. In addition, a portion of the photosensitive layer 11 locatedon the surface of the substrate 100 in the non-sensor area NSA is notexposed.

The exposed portions of the photosensitive layer 11 are removed by adevelopment process. As a result, a photosensitive layer pattern 110including a first pattern 111 located in the sensor area SA, a secondpattern 113 located in the non-sensor area NSA, and a third pattern 115located in the wiring area WA, is formed as illustrated in FIG. 12 .

A thickness of the first pattern 111 may be less than a thickness of thesecond pattern 113. For example, a height H1 (measured from the surfaceof the substrate 100 to a top surface of the first pattern 111) may beless than a height H2 (measured from the surface of the substrate 100 toa top surface of the second pattern 113).

In addition, a thickness of the third pattern 115 may be less than athickness of the second pattern 113. For example, a height H3 (measuredfrom the surface of the substrate 100 to a top surface of the thirdpattern 115) may be less than the height H2 (measured from the surfaceof the substrate 100 to the top surface of the second pattern 113).

Next, the photosensitive layer pattern 110 is dried, thereby forminggaps 111 b in the first pattern 111 and gaps 115 b in the third pattern115, as illustrated in FIG. 13 . In other words, the dried first pattern111 includes the gaps 111 b and remaining patterns 111 a between thegaps 111 b, and the third pattern 115 includes the gaps 115 b andremaining patterns 115 a between the gaps 115 b. To form the gaps 111 band 115 b, heat may be applied to the photosensitive layer pattern 110,and physical impact (such as vibrations) may be applied to thephotosensitive layer pattern 110. In addition, a chemical treatmentprocess using an etchant may be performed to form the gaps 111 b and 115b. In some embodiments, the density and interval between the gaps 111 band 115 b may be adjusted by controlling the temperature and duration ofthe heat treatment that is applied to the photosensitive layer pattern110.

Referring to FIG. 14 , a metal layer 20 is formed on the surface of thesubstrate 100 and the photosensitive layer pattern 110.

A portion of the metal layer 20 is deposited on the first pattern 111and fills the gaps 111 b to form a plurality of first fine metal lines210 a. Also, a portion of the metal layer 20 is deposited on the thirdpattern 115 and fills the gaps 115 b to form a plurality of second finemetal lines 270 a. Since the metal layer 20 is formed over the entiresurface of the substrate 100, a portion 230 of the metal layer 20 isformed on the second pattern 113.

When the first, second, and third patterns 111, 113, and 115 of thephotosensitive layer pattern 110 are removed, the portion 230 of themetal layer 20 located on the second pattern 113 will be removed via a“lift-off” process. Accordingly, a touch panel including a wiring line270 located on the surface of the substrate 100 in the wiring area WAand a sensing pattern 210 located on the surface of the substrate 100 inthe sensor area SA, is formed as illustrated in FIG. 15 . The sensingpattern 210 includes a mesh of the first fine metal lines 210 previouslydescribed with reference to FIGS. 1 through 4 . Also, the wiring line270 includes a mesh of the second fine metal lines 270 a previouslydescribed with reference to FIG. 10 .

As shown in FIG. 15 , spaces 210 b are formed between the first finemetal lines 210 a. In some instances, some of the remaining patterns 111a may not be completely removed and may remain in some of the spaces 210b. Specifically, part of the first pattern 111 may remain in some of thespaces 210 b as a photosensitive layer pattern residue Q1.

Likewise, spaces 270 b are formed between the second fine metal lines270 a. In some instances, some of the remaining patterns 115 a may notbe completely removed and may remain in some of the spaces 270 b.Specifically, part of the third pattern 115 may remain in some of thespaces 270 b as a photosensitive layer pattern residue Q2.

In some embodiments (not shown), the exemplary method described in FIGS.5 through 9 may further include forming an insulating layer pattern 240(see, e.g., FIG. 4 ) and forming a second connector 250 (see, e.g., FIG.2 ).

A touch panel having improved detection sensitivity and transmittance,and a method of manufacturing the touch panel, are disclosed in theabove embodiments.

While the inventive concept has been described with reference toexemplary embodiments, it will be understood by one of ordinary skill inthe art that various changes may be made to the embodiments withoutdeparting from the spirit and scope of the inventive concept.

What is claimed is:
 1. A touch sensor comprising: a substrate comprisinga wiring area and a sensor area; a plurality of sensing patterns locatedon the substrate in the sensor area and arranged in a regular pattern;and a wiring line located on the substrate in the wiring area andelectrically connected to the plurality of sensing patterns, whereineach of the plurality of sensing patterns comprises a plurality of firstfine metal lines arranged within a corresponding sensing pattern in amesh pattern when viewed in a plan view of the touch sensor, and a firstphotosensitive layer pattern residue located between at least two of thefirst fine metal lines, wherein an entirety of the first photosensitivelayer pattern residue is made of a photosensitive resin, wherein theplurality of first fine metal lines are made of a same material, andwherein the plurality of first fine metal lines and the firstphotosensitive layer pattern residue are both disposed directly on asame layer.
 2. The touch sensor of claim 1, wherein the wiring lineincludes the same material.
 3. The touch sensor of claim 2, wherein eachof the plurality of sensing patterns and the wiring line comprises anyone of molybdenum (Mo), silver (Ag), titanium (Ti), aluminum (Al),copper (Cu), gold (Au), platinum (Pt), and nickel (Ni), or an alloythereof.
 4. The touch sensor of claim 1, wherein the firstphotosensitive layer pattern residue is made of a positivephotosensitive resin.
 5. The touch sensor of claim 1, wherein the wiringline comprises a plurality of second fine metal lines arranged in a meshpattern, and a second photosensitive layer pattern residue locatedbetween at least two of the second fine metal lines.
 6. The touch sensorof claim 1, wherein the substrate is a transparent substrate.
 7. Thetouch sensor of claim 1, wherein the substrate is made of an insulatingmaterial selected from a group comprising glass, plastic, silicon andsynthetic resin.
 8. The touch sensor of claim 1, wherein the substrateis made of a flexible film.
 9. The touch sensor of claim 1, wherein thesubstrate further comprises a non-sensor area, and none of the pluralityof sensing patterns and the wiring line is located in the non-sensorarea.
 10. The touch sensor of claim 1, wherein the plurality of sensingpatterns comprises a plurality of first sensing patterns extending in afirst direction and a plurality of second sensing patterns extending ina second direction that is different from the first direction.